A new Xperia Z2 flagship smart phone is expected to debut at MWC 2014 next month but Sony seems to be busy with another upcoming device. A XDA Developers member had leaked a purported new Xperia model which appears to be a facelift of the current Xperia Z1.
The device which carries a purported D6503 model retains the same omni-balance design with metallic frame at the sides and feature a couple of design changes. Firstly the lanyard hole is moved from the bottom right to left while the microSD & SIM tray is now covered with a single flap instead of individual flap covers found on the Xperia Z1. The speaker and microphone mesh grill located at the bottom is also replaced with a cleaner 3 hole design as well.
While it is hard to confirm anything through the images, the new Z1 “facelift” device could possibly be thinner and comes with a slightly larger 5.2″ display. In terms of hardware, it is speculated to be running on a Snapdragon 800AB processor with 3GB of RAM. With the use of flaps retained, it is likely to be water and dust resistant as well.
Head after the break for more shots of the new device.