Samsung’s SM-W2016, which was first leaked by GFXBench on their website last month and will most likely be the Samsung’s brand new flip phone, the Galaxy Golden 3, has been certified by China’s regulatory agency TENAA.
According to TENAA, the next iteration of Samsung’s flip phone series will feature 3.9-inch internal and external screens, both with a 768 x 1280 resolution. The flip phone will also feature an octa-core 2.1GHz CPU with 3GB of RAM along with 64GB of non-expandable storage under the hood. The Galaxy Golden 3 will come pre-loaded with Android 5.1.1 Lollipop.
This latest leak raises some questions regarding the actual size of the Galaxy Golden 3’s screen as GFXBench had listed the screen size to be 4.6 inches. Regardless, the flip phone will come with a 16-megapixel rear shooter and a 5-megapixel front facing camera for selfies and video chats. While no information on the chipset type was revealed by TENAA, GFXBench alleges that the Galaxy Golden 3 will get a high-end Exynos 7 SoC with a Mali-T760MP8 GPU.
The Galaxy Golden 3 will weigh 204 grams, up 24 grams from the original model’s 179 grams and will be 15.1mm thick. This thickness comes as no surprise because flip phones have always had the tendency to be thicker than its unhinged counterpart.
While the phone itself has not been announced by Samsung, the previous Galaxy Golden and Galaxy Golden 2 have been given the model number SM-W2014 and SM-W2015 respectively. Logic then dictates that the SM-W2016 would be the Galaxy Golden 3. Unfortunately TENAA did not publish any photographs of the phone, however, now that it has received its certification, we could likely see the flip phone revealed by Samsung soon.
Although clamshell phones are no longer popular, a big part due to the inconvenience of actually having to flip the phone open as well some instances of wonky phone displays due to the hinge, it seems that Samsung still believes in this relatively niche market as this would be the third installment of the Galaxy Golden phone series.