Rumours of HTC’s upcoming M8 flagship are trickling in and now alleged casings for the yet to be launched smart phone have surfaced on Alibaba. Following the latest speculation of a Twin Sensor Ultrapixel camera, the purported new casings seems to confirm such details with an additional hole at the top.
The hole cuttings seems to match the first leaked image we saw earlier. The recent report by Bloomberg suggests a twin sensor camera to be appearing this year but some speculates that it could be a finger print scanner similar to the one found on the HTC One Max. The power button placement appears to be different on the M8 with the case having the button cut out on the top right instead of the usual top left found on the current HTC One.
Do take this with a pinch of salt as this could possibly be an overreaction by some enterprising manufacturers. Before the iPhone 5 was officially announced, we have seen bad examples of casings being produced based on mere speculation or leaked prototypes. All shall be revealed closer to launch that’s said to be happening in end February/early March this year.
Another case design of the alleged HTC M8 after the break.
BMW has unveiled the new BMW i3, its first fully electric 3 Series for the…
This post is brought to you by AEON Bank. AEON Bank has introduced several exciting…
The Poco X8 Pro and X8 Pro Max have officially launched and they are now…
Renowned tyre retailer and automotive service provider, Lim Tayar, has recently hosted the 3rd Berbuka…
U Mobile has announced that Mawar Setia Sdn. Bhd. now holds more than 50% shareholding…
MCash has announced its direct participation in Payments Network Malaysia (PayNet), enabling DuitNow QR payments…
This website uses cookies.