Rumours of HTC’s upcoming M8 flagship are trickling in and now alleged casings for the yet to be launched smart phone have surfaced on Alibaba. Following the latest speculation of a Twin Sensor Ultrapixel camera, the purported new casings seems to confirm such details with an additional hole at the top.
The hole cuttings seems to match the first leaked image we saw earlier. The recent report by Bloomberg suggests a twin sensor camera to be appearing this year but some speculates that it could be a finger print scanner similar to the one found on the HTC One Max. The power button placement appears to be different on the M8 with the case having the button cut out on the top right instead of the usual top left found on the current HTC One.
Do take this with a pinch of salt as this could possibly be an overreaction by some enterprising manufacturers. Before the iPhone 5 was officially announced, we have seen bad examples of casings being produced based on mere speculation or leaked prototypes. All shall be revealed closer to launch that’s said to be happening in end February/early March this year.
Another case design of the alleged HTC M8 after the break.
Bermaz XPeng, the sole distributor of XPeng in Malaysia, has just launched the most affordable…
Proton e.MAS 7 PHEV is now officially available for booking. According to Pro-Net, the national…
Universiti Pertahanan Nasional Malaysia (UPNM) is expected to reduce its annual electricity expenditure by approximately…
Astro has announced that it will stop accepting new Astro Fibre subscriptions starting 1st February…
The Malaysian Communications and Multimedia Commission (MCMC) has confirmed that it is taking legal action…
Volvo has issued a global recall for affected electric vehicles (EV), particularly the EX30 due…
This website uses cookies.