Before anyone could blend or break the Galaxy S II down to its components, Samsung has released an official tear down of the device. Unlike iFixit step by step dismantling, Samsung offers an overview of its components hidden under that 8.98.49mm thin body.
It shows you where the vital components are located as well as materials used in its construction. For example the back plate uses a 0.1mm thin Hyperskin material which features 3000 chain patterns to prevent scratches, fingerprints and slips.
To check it out in detail, head over to Samsung’s Global Blog.
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