Before anyone could blend or break the Galaxy S II down to its components, Samsung has released an official tear down of the device. Unlike iFixit step by step dismantling, Samsung offers an overview of its components hidden under that 8.98.49mm thin body.
It shows you where the vital components are located as well as materials used in its construction. For example the back plate uses a 0.1mm thin Hyperskin material which features 3000 chain patterns to prevent scratches, fingerprints and slips.
To check it out in detail, head over to Samsung’s Global Blog.
DC Handal has deployed a new high-powered DC charger in Ipoh and it is currently…
Infinix is expanding its physical retail footprint in Malaysia with a new brand store at…
Following earlier teasers, CMF by Nothing has officially launched the CMF Clip Pro, marking the…
The 2nd generation BMW iX3 is now officially in Malaysia, marking the beginning of the…
MBSB Bank customers can now add their Visa Debit Card-i to Samsung Wallet and Google Pay, allowing them…
Almost 4 years after the feature arrived in Malaysia, Apple Pay is now finally available…
This website uses cookies.