TP-Link aspires to be a serious contender in the mobile business. Not contented with just making affordable smartphones, they are turning things up a notch by announcing its new Neffos X1 and X1 Max at IFA 2016. These are their first attempt on an all-metal smartphone.
Unlike its previous models, the Neffos X1 and X1 Max is more premium to hold thanks to a metal back with chamfered edges. The X1 has a 5″ HD 720p display while the larger X1 Max has a 5.5″ Full HD unit. Both models get 2.5D Corning Gorilla Glass for a more seamless appearance.
Under the hood, the X1 and X1 Max runs on a mid-range Helio P10 Octa-Core processor with 2 possible variants for each model. The Neffos X1 comes with either 2GB RAM + 16GB storage or 3GB RAM + 32GB storage options. Meanwhile the larger X1 Max gets either a 3GB RAM + 32GB storage or a 4GB RAM + 64GB storage version. If you need more storage, both accepts MicroSD card up to 128GB.
In the photography department, the Neffos X1 uses a 13MP Sony IMX258 sensor that has PDAF and it is accompanied by a dual-tone LED flash. Over at the front lies a 5MP shooter with real-time beautification mode for your selfie needs. Like most smartphones today, it also has a rear-mounted fingerprint sensor which allows you to unlock in just 0.2 seconds.
An interesting addition is a dedicated alert slider on the left, which is like what you get on the OnePlus 3. Powering the Neffos X1 is a 2,250mAh battery while the X1 Max gets a larger 3,000mAh capacity. The X1 Max supports quick charging which does 50% charge in just 30 minutes.
In terms of connectivity, the Neffos X1 and X1 Max has 802.11n Wifi, Bluetooth 4.1 and it supports dual-SIM with 4G LTE. Both devices are currently running on Android 6.0 Marshmallow which will eventually get Android 7.0 Nougat.
The Neffos X1 is going from €199 (about RM911) while the X1 Max is priced from €249 (about RM1,140). Both phones will be available in Q4 2016 and Malaysia will be among the first wave countries to get it.
